Snapdragon 875 vs Kirin 9000: Full Specs Comparison
The Qualcomm Snapdragon 875 chipset is not launched yet, it is about to launch in December. The comparion is based on its potential features.
Qualcomm Snapdragon 875 vs HiSilicon Kirin 9000
CPU:
Both chipsets feature a tre-cluster 64 bit octa-core CPU where the Qualcomm Snapdragon 875 features 1 ARM Cortex-X1 Prime Core operating @2.84GHz, 3 ARM Cortex-A77 Gold Cores @2.42GHz and 4 ARM Cortex-A55 Silver Cores@1.80GHz whereas the HiSilicon Kirin 9000 arives with 1 ARM Cortex-A77 Prime Core clocked @3.13GHz, 3 ARM Cortex-A77 Middle Cores @2.54GHz and 4 ARM Cortex-A55 Little Cores @2.05GHz clock speed.
GPU:
In the GPU section, the Qualcomm Snapdragon 875 comes with the Adreno 660 GPU while the HiSilicon Kirin 9000 integrates an ARM Mali-G78 24-Cores GPU.
Manufacturing Process:
Speaking of the HiSilicon Kirin 9000, it is built using 5nm LPP node while the Snapdragon 875 is also fabricated on the 5nm process technology. Here both, Kirin 9000 and SD 875 use the same power and both are power-efficient chipsets.
Originally published on Mobilestalk.net
